Exclusive

Publication

Byline

Location

US Patent Issued to Mellanox Technologies on Aug. 4 for "Efficient thermal management for vertical power delivery" (American, Israeli Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,651, issued on Aug. 4, was assigned to Mellanox Technologies Ltd. (Yokneam, Israel). "Efficient thermal management for vertical power delive... Read More


US Patent Issued to HongQiSheng Precision Electronics (QinHuang Dao), Avary Holding (Shenzhen) Co. Ltd., GARUDA TECHNOLOGY on Aug. 4 for "Flexible circuit board and method for manufacturing same" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,652, issued on Aug. 4, was assigned to HongQiSheng Precision Electronics (QinHuang Dao) Co. Ltd. (Qinhuangdao, China), Avary Holding (Shenzhe... Read More


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Aug. 4 for "Printed circuit board" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,653, issued on Aug. 4, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by J... Read More


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Aug. 4 for "Circuit board and manufacturing method thereof" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,654, issued on Aug. 4, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Circuit board and manufacturing method t... Read More


US Patent Issued to TAIYO HOLDINGS on Aug. 4 for "Structure body and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,655, issued on Aug. 4, was assigned to TAIYO HOLDINGS Co. LTD. (Hiki-gun, Japan). "Structure body and wiring board" was invented by Shoya Se... Read More


US Patent Issued to LG Energy Solution on Aug. 4 for "Printed circuit board, manufacturing method thereof, and battery pack including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,656, issued on Aug. 4, was assigned to LG Energy Solution Ltd. (Seoul, South Korea). "Printed circuit board, manufacturing method thereof, a... Read More


US Patent Issued to Medtronic on Aug. 4 for "Electrical component and method of forming same" (Arizona Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,657, issued on Aug. 4, was assigned to Medtronic Inc. (Minneapolis). "Electrical component and method of forming same" was invented by Chunh... Read More


US Patent Issued to IBIDEN on Aug. 4 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,658, issued on Aug. 4, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masashi Kuwabara (Ibi-gun, Japan) ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Circuit board module and method for manufacturing same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,659, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Circuit board module and method for manufactur... Read More


US Patent Issued to Monolithic Power Systems on Aug. 4 for "Sandwich structure power supply module" (Chinese, American Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,660, issued on Aug. 4, was assigned to Monolithic Power Systems Inc. (San Jose, Calif.). "Sandwich structure power supply module" was invent... Read More